A Study on the Electrical Properties of Pt Thin film RTD for Temperature Sensor
온도센서용 Pt박막 측온저항체의 전기적 특성에 관한 연구
문중선;정광진;최성호;조동율;천희곤;
울산대학교 재료, 금속 공학부;
한국표면공학회지, Vol. 32, No. 1, pp. 3-9.
DOI :
Shape and Chemical Composition Change of Laser Spot Alloyed Layer with Process Parameters
공정변수에 따른 Laser spot 합금층의 형상 및 성분변화 예측
최정영;이창희;
No address;
한국표면공학회지, Vol. 32, No. 1, pp. 10-20.
DOI :
A Study on Coating Adhesion of Hot Rolled Galvanized Iron Manufactured without pickling process
산세생략형 열연 용융아연도금강판의 특성
최진원;전선호;
포항종합제철주식회사 기술연구소 광양압연연구그룹;
한국표면공학회지, Vol. 32, No. 1, pp. 21-30.
DOI :
Effect of Al content on coating adhesion of hot rolled galvanized iron manufactured without pickling process
무산세 열연 용융아연도금강판의 도금밀착성에 미치는 도금욕 Al농도의 영향
전선호;최진원;
포항종합제철주식회사 기술연구소 광양압연연구그룹;
한국표면공학회지, Vol. 32, No. 1, pp. 31-42.
DOI :
A Surface Study of 304 and 316 Stainless Steel Oxidized between
김경록;이경구;강창석;최답천;이도재;
전남대학교 공과대학 금속공학과;한려대학교 제철금속학과;
한국표면공학회지, Vol. 32, No. 1, pp. 43-48.
DOI :
A Study on the Cyclic Oxidation Properties of Aluminum Diffusion Coated Materials
알루미늄 확산코팅재료의 주기산화 특성에 관한 연구
강석철;민경만;김길무;
한국원자력안전기술원;충남대학교 재료공학과, 급속응고신소재연구소;
한국표면공학회지, Vol. 32, No. 1, pp. 49-60.
DOI :
Tunneling magnetoresistance in ferromagnetic tunnel junctions with conditions of insulating barrier preparation
부도체층 제작조건에 따른 강자성 터널접합의 투과자기저항 특성 연구
백주열;현준원;
단국대학교 물리학과;단국대학교 응용물리학과;
한국표면공학회지, Vol. 32, No. 1, pp. 61-66.
DOI :
Effect of the Heat treatment and Boron on the Hot Corrosion Resistance of the Al Diffusion Coating
Al 확산피복층의 고온 내식성에 미치는 후열처리와 B첨가의 영향
김태원;윤재홍;이재현;김현수;변응선;
창원대학교 공과대학 금속재료공학과;동북공업기술연구소 환경재료 연구실;한국기계연구원;
한국표면공학회지, Vol. 32, No. 1, pp. 67-77.
DOI :
A study of the GaN etch properties using inductively coupled Cl
유도 결합형 Cl
김현수;이재원;김태일;염근영;
성균관대학교 재료공학과;삼성종합기술원 광반도체연구실;
한국표면공학회지, Vol. 32, No. 2, pp. 83-92.
DOI :
Investigation of the residue formed on the silicon exposed to
고선택비 산화막 식각공정시
김현수;이원정;염근영;
성균관대학교 재료공학과 반도체 공정 연구실;
한국표면공학회지, Vol. 32, No. 2, pp. 93-99.
DOI :
Microstructure and Corrosion Characteristics of Al-Si Diffusion Coated Ni Base Super alloy
Al-Si확산코팅에 따른 Ni기 초합금의 미세조직과 부식특성
안종천;김택수;윤동주;이경구;
국방과학연구소;충남대학교 금속공학과;한려대학교 제철금속학과;
한국표면공학회지, Vol. 32, No. 2, pp. 100-108.
DOI :
Field Application of an Alternative Cleaning Agent to Methylene Chloride
Methylene Chloride의 대체세정제 적용 사례 연구
배재흠;신민철;이통영;조기수;
수원대학교 화학공학과;삼성전기;삼성지구환경연구소;
한국표면공학회지, Vol. 32, No. 2, pp. 109-124.
DOI :
Electrical and Optical Properties of SnO
반응성 DC 마그네트론 스퍼터법에 의한 SnO
정영호;김영진;신재혁;송국현;신성호;박정일;박광자;
경기대학교 재료공학과;국립기술품질원;
한국표면공학회지, Vol. 32, No. 2, pp. 125-133.
DOI :
Effect of silicon on alloying behavior of hot-dip galvannealed steel sheets
합금화 용융아연 도금강판의 합금화 거동에 미치는 실리콘의 영향
이호종;김종상;
순천대학교 공과대학 재료·금속공학과;포항제철(주) 기술연구소;
한국표면공학회지, Vol. 32, No. 2, pp. 134-143.
DOI :
A Study on the high Temperature Properties of the Graded Thermal Barrier Coatings by APS and PAS
APS법으로 제조된 열장벽 피막과 PAS법으로 제조된 열장벽 성형체의 고온 물성에 관한 연구
강현욱;권현옥;한주철;송요승;홍상희;허성강;김선화;
한국항공대학교 항공재료공학과;서울대학교;창원대학교;순천향대학교;
한국표면공학회지, Vol. 32, No. 2, pp. 144-156.
DOI :
Effect of Nickel Addition in Hot Dip Galvanizing of Mini-mill Steels Containing Silicon
실리콘을 함유한 미니밀 소재의 용융아연도금성에 미치는 니켈첨가의 영향
[H. J., Lee;J. S., Kim;J. H., Chung;]
Dept. of Materials Science and Metallurgical Eng., Sunchon National University;Technical Research Laboratories, POSCO;
한국표면공학회지, Vol. 32, No. 2, pp. 157-164.
DOI :
Surface Reaction of Uranium Dioxide with CF
CF
민진영;김용수;
한양대학교 원자력공학과;
한국표면공학회지, Vol. 32, No. 2, pp. 165-171.
DOI :
A Study on Electroless Ni-B Plating with DMAB as Reducing Agent. I. The Electrochemical Behavior of Precipitation Reaction on Austenite Stainless Steel Substrates
DMAB를 사용한 무전해 Ni-B 합금 도금 I. 오스테나이트 스텐레스강 상의 석출반응에 대한 전기화학적 거동
이창래;박해덕;강성군;
한양대학교 공과대학 재료공학과;(유) 해송피앤씨;
한국표면공학회지, Vol. 32, No. 2, pp. 172-181.
DOI :
Electrodeposited Multilayer Coating Systems
[Gabe, David R.;]
International Union for Surface Finishing and Iptme, Loughborough Univ.;
한국표면공학회지, Vol. 32, No. 3, pp. 195-207.
DOI :
STUDY FOR DEVELOPMENT OF AN ADDITIVE FOR SEMI-BRIGHTNESS FINISH FOR NICKEL ELECTOPLATING
[Han, M.K.;Lee, J.K.;]
Korea Institute of Industrial Technology (KITECH);
한국표면공학회지, Vol. 32, No. 3, pp. 208-210.
DOI :
[Yada, Y.;Tokio, K.;]
2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;
한국표면공학회지, Vol. 32, No. 3, pp. 211-213.
DOI :
THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION
[Kim, Go-Eun;Lee, Jae-Ho;]
Dept. of Metallurgical Engineering and Materials Science Hongik University;
한국표면공학회지, Vol. 32, No. 3, pp. 214-218.
DOI :
Ferrous Chloride Pickling Bath A new process for pre-treatment of metals
[Ericson, U.H.;Ericson, H.A.H.;]
Korrosionsforskning AB, Sweden;Corrint Svenska KB, Sweden;
한국표면공학회지, Vol. 32, No. 3, pp. 219-223.
DOI :
[Lee, Dong-hun;Lee, Jae-Bong;]
School of Metallurgical and Materials Engineering Kookmin University;
한국표면공학회지, Vol. 32, No. 3, pp. 224-234.
DOI :
ANALYSIS OF THE ANODIC OXIDATION OF SINGLE CRYSTALLINE SILICON IN ETHYLEN GLYCOL SOLUTION
[Yuga, Masamitsu;Takeuchi, Manabu;]
Graduate School of Science and Engineering, Ibaraki University;Department of Electrical and Electronic Engineering, Ibaraki University;
한국표면공학회지, Vol. 32, No. 3, pp. 235-238.
DOI :
[Kim, Heung-Rak;Kun-Kul, Ryoo;]
Research Institute of Industrial Science and Technology;Soonchunhyang University;
한국표면공학회지, Vol. 32, No. 3, pp. 239-243.
DOI :
[Yoshihara, S.;Shinozaki, K.;Shirakashi, T.;]
Department of Energy and Environmental Science, Graduate School of Engineering, Utsunomiya University;
한국표면공학회지, Vol. 32, No. 3, pp. 244-248.
DOI :
BORIDING OF STEEL WITH PECVD METHOD
[Lee, M.J.;Lee, K.Y.;Lee, J.H.;Kim, Y.H.;]
Dept. of Metallurgical Engineering and Materials Science Hongik University;
한국표면공학회지, Vol. 32, No. 3, pp. 249-252.
DOI :
[Kwon, Sik-Chol;Baek, Woon-Sung;Lee, Gun-Hwan;Rha, Jong-Joo;]
KIMM;
한국표면공학회지, Vol. 32, No. 3, pp. 253-256.
DOI :
[Ri, Eui-Jae;Hoang, Tae-Su;]
KITech (SaengGiUeon);
한국표면공학회지, Vol. 32, No. 3, pp. 257-264.
DOI :
NEW PROGRESS IN TiN-BASED PROTECTIVE COATINGS DEPOSITED BY ARC ION PLATING
[Huang, R.F.;Wen, L.S.;]
SES and City University of Hong Kong Hong Kong;Institute of Metal Research, Academia Sinica;
한국표면공학회지, Vol. 32, No. 3, pp. 265-275.
DOI :
ELECTRICAL PROPERTIES OF ELECTROCHROMIC INDIUM NITRIDE THIN FILMS PREPARED BY RF ION PLATING
[Asai, N.;Inoue, Y.;Sugimura, H.;Takai, O.;]
Department of Materials Processing Engineering, Graduate School of Engineering, Nagoya University;
한국표면공학회지, Vol. 32, No. 3, pp. 276-280.
DOI :
MICROSTRUCTURE AND ELECTROCHEMICAL CHARACTERISTICS OF ELECTRODEPOSITED Zn-Ni ALLOY COATINGS
[Short, N.R.;Hui, Wen-Hua;Dennis, J.K.;]
School of Engineering and Applied Science, Aston University;Department of Materials Science & Engineering, Stevens Institute of Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 281-288.
DOI :
THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES
[Takagi, Kiyoshi;]
TAKAGI Associates;
한국표면공학회지, Vol. 32, No. 3, pp. 289-296.
DOI :
INFRARED ABSORPTION MEASUREMENT DURING LOW-TEMPERATURE PECVD OF SILICON-OXIDE FILMS
[Inoue, Yasushi;Sugimura, Hiroyuki;Takai, Osamu;]
Department of Materials Processing Engineering, Nagoya University;
한국표면공학회지, Vol. 32, No. 3, pp. 297-302.
DOI :
EFFECT OF SUBSTRATE BIAS ON THE DIAMOND GROWTH USING MICROWAVE PLASMA CVD
[Sakamoto, Yukihiro;Takaya, Matsufumi;]
Chiba Institute of Technology, Precision Engineering;
한국표면공학회지, Vol. 32, No. 3, pp. 303-306.
DOI :
PREPARATION OF HYDROXYAPATITE COATINGS USING R.F. MAGNETRON SPUTTERING
[Hosoya, Satoru;Sakamoto, Yukihiro;Hashimoto, Kazuaki;Takaya, Matsufumi;Toda, Yoshitomo;]
Graduate school, Chiba Institute of Technology;Department of Precision Engineering, Chiba Institute of Technology;Department of Industrial Chemistry, Chiba Institute of Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 307-311.
DOI :
REACTION STEPS OF A FORMATION OF THE BLACK LAYER BEIWEEN IRON NTIRIDE AND TiN COATING
[Baek, W.S.;Kwon, S.C.;Lee, J.Y.;Rha, J.J.;Lee, S.R.;Kim, K.H.;]
Korea Institute of Machinery and Materials (KIMM);Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST);Department of Metallurgy and Material, Yeungnam Univ.;
한국표면공학회지, Vol. 32, No. 3, pp. 312-316.
DOI :
TEXTURE AND RELATED PHENOMENA OF ELECTRODEPOSITS
[Lee, D.N.;]
Division of Materials Science and Engineering, and Research Center for Thin Film Fabrication and Crystal Growing of Advanced Materials, Seoul National University;
한국표면공학회지, Vol. 32, No. 3, pp. 317-330.
DOI :
ELECTROLESS PLATING OF NICKEL FOR MICRO-STRUCTURE FABRICATION
[Jin, Huh;Lee, Jae-Ho;]
Dept. of Metallurgical Engineering and Materials Science, Hongik University;
한국표면공학회지, Vol. 32, No. 3, pp. 331-335.
DOI :
PHOTOCATALYTIC REACTION OF
[Yin, X.J.;Cai, R.X.;]
Chemical Process & Biotechnology Department, Singapore Polytechinc;Chemical Technology Centre, Singapore Productivity and Standards Board;
한국표면공학회지, Vol. 32, No. 3, pp. 336-339.
DOI :
ELECTRICAL BREAKDOWN INITIATION OF ANODIC FILMS DURING ANODIZING IN MOLTEN BISULPHATE MELT
[Han, S.H.;Thompson, G.E.;]
Cleaner Production Centre, Korea Institute of Industrial Technology;Corrosion and Protection Centre, University of Manchester Institute of Science and Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 341-343.
DOI :
EFFECT OF ARGON AND OXYGEN PLASMAS ON VARIOUS POLYETHYLENE SHEETS
[Chen, Yashao;Hirayama, Naoki;Gomi, Masaki;Kiuchi, Kenji;Momose, Yoshihiro;]
Department of Materials Science, Ibaraki University;
한국표면공학회지, Vol. 32, No. 3, pp. 344-350.
DOI :
MODIFICATION OF INITIALLY GROWN BN LAYERS BY POST-N
[Byon, E.S.;Lee, S.H.;Lee, S.R.;Lee, K.H.;J. Tian;Youn, J.H.;Sung, C.;]
Korea Institute of Machinery & Materials;Harbin Institute of Technology;Changwon National University;Center for Advanced Materials, University of Massachusetts;
한국표면공학회지, Vol. 32, No. 3, pp. 351-355.
DOI :
HYDROXYAPATITE GRANULE IMPLANTED Ti-ALLOY
[Nonami, Toru;Taoda, Hiroshi;Kamiya, Akira;Naganuma, Katsuyoshi;Sonoda, Tsutomu;Kameyama, Tetsuya;]
National Industrial Research Institute of Nagoya;
한국표면공학회지, Vol. 32, No. 3, pp. 356-359.
DOI :
INVESTIGATION OF "STEPPED" DISCHARGE CURVES IN SINTERED TYPE NICKEL-CADMIUM CELL
[Sasaki, Y.;Yamashita, T.;]
Faculty of Engineering, Kanto Gakuin University;
한국표면공학회지, Vol. 32, No. 3, pp. 360-362.
DOI :
DISCHARGE CHARACTERISTICS OF NICKELOXIDE ELECTRODE PREPARED FROM ELECTROCHEMICAL IMPREGNATION
[Takenoya, K.;Sasaki, Y.;Yamashita, T.;]
Faculty of Engineering, Kanto Gakuin University;
한국표면공학회지, Vol. 32, No. 3, pp. 363-365.
DOI :
ON THE SONO-VOLTAMMETRY CURVES OF POLYCRYSTALLINE PLATINUM ELECTRODE IN SULFURIC ACID SOLUTION
[Chiba, Atsushi;Kobayashi, Katsuyoshi;Yamashita, Tsugito;]
Department of Materials Chemistry, Yokohama National University;Department of Industrial Chemistry, Kantogakuin Uneversity;
한국표면공학회지, Vol. 32, No. 3, pp. 366-371.
DOI :
CRYSTAL ORIENTATION OF ELECTROLESS COPPER AND ELECTRODEPOSITED NICKEL FILMS ON THE MAGNETS
[Chiba, Atsushi;Kobayashi, Katsuyoshi;Miyazaki, Hiroki.;Yoshihara, Sachio;Wu, Wen-Chang;]
Department of Materials Chemistry, Yokohama National University;Department of Industrial Chemistry, Utsunomiya University;Department of Chemical Engineering, Nan-Tai, Institute of Technology.;
한국표면공학회지, Vol. 32, No. 3, pp. 372-376.
DOI :
EFFECTS OF AMINES ON COPPER ETCHING WITH H
[Kobayashi, Katsuyoshi;Minami, Naoki;Chiba, Atsushi;]
Department of Materials Chemistry, Yokohama National University;Department of Research and Development, Ferric Inc.;
한국표면공학회지, Vol. 32, No. 3, pp. 377-384.
DOI :
Electron field emission from various CVD diamond films
[Usikubo, Koji;Sakamoto, Yukihiro;Takaya, Matsufumi;]
Graduate school, Chiba Institute of Technology;Chiba Institute of Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 385-388.
DOI :
VOID DEFECTS IN COBALT-DISILICIDE FOR LOGIC DEVICES
[Song, Ohsung;Ahn, Youngsook;]
Department of Materials Science and Engineering, The University of Seoul;
한국표면공학회지, Vol. 32, No. 3, pp. 389-392.
DOI :
THE SURFACE CHARACTERISTICS OF NITROGEN ION IMPLANTED IRON ALUMINIDES
[Choe, Han-Cheol;]
Dept. of Metallurgical Engineering & IAGC Research Institute, Kwang Yang College;
한국표면공학회지, Vol. 32, No. 3, pp. 393-400.
DOI :
[Hoang, Tae-Su;Ri, Eui-Jae;]
KITech (SaengGiUeon);
한국표면공학회지, Vol. 32, No. 3, pp. 401-405.
DOI :
[Ri, Eui-Jae;Hoang, Tae-Su;]
KITech (SaengGiUeon);
한국표면공학회지, Vol. 32, No. 3, pp. 406-409.
DOI :
ADHESION STUDIES OF MAGNETRON-SPUTTERED COPPER FILMS ON INCONEL SUBSTRATES
[Lee, G.H.;Kwon, S.C.;Lee, S.Y.;]
Surface Engineering Laboratory, KIMM;Assessment & Planning, STEPI;
한국표면공학회지, Vol. 32, No. 3, pp. 410-415.
DOI :
A Study of Dry Etch Mechanism of the GaN using Plasma Mass Spectrometry
[Kim, H.S.;Lee, W.J.;Jang, J.W.;Yeom, G.Y.;Lee, J.W.;Kim, T.I.;]
Dept. of Materials Engineering, Sungkyunkwan University;Photonics Lab., Samsung Advanced Institute of Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 416-422.
DOI :
Plating of Permalloy Using Flow Cell
[Jeon, S.H.;Ahn, J.H.;Kang, T.;]
School of Materials Science and Engineering, Seoul National University;
한국표면공학회지, Vol. 32, No. 3, pp. 423-427.
DOI :
EFFECT OF ION BEAM ASSISTED CLEANING ON ADHESION OF ALUMINIUM TO POLYMER SUBSTRATE OF PC AND PMMA
[Kwon, Sik-Chol;Lee, Gun-Hwan;Lee, Chuel-Yong;Gob, Han-Bum;Lim, Jun-Seop;Goh, Sung-Jin;]
Surface Engineering Laboratory, KIMM;Aju Engineering Co.;
한국표면공학회지, Vol. 32, No. 3, pp. 428-432.
DOI :
PROPERTIES OF Mo COMPOUNDS AS A DIFFUSION BARRIER BETWEEN Cu AND Si PREPARED BY CO-SPUTTERING
[Lee, Yong-Hyuk;Park, Jun-Yong;Bae, Jeong-Woon;Yeom, Geun-Young;]
Department of Materials Engineering, SungKyunKwan University;
한국표면공학회지, Vol. 32, No. 3, pp. 433-439.
DOI :
CRYSTAL TRANSITION PROCESS DURING POST-BREAKDOWN IN THE MOLTEN SALT
[Han, S.H.;Thompson, G.E.;]
Cleaner Production Centre, Korea Institute of Industrial Technology;Corrosion and Protection Centre, University of Manchester Institute of Science and Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 440-443.
DOI :
A STUDY ON COPPER DEPOSITION PROCESS DURING ANODIC OXIDATION OF ALUMINIUM ALLOY
[Koh, I.S.;Han, S.H.;Shin, D.H.;]
Department of Metal & Material Science Engineering, Hanyang University;Cleaner Production Centre, Korea Instituteof Industrial Technology;
한국표면공학회지, Vol. 32, No. 3, pp. 444-446.
DOI :
ELECTROCHEMICAL STUDY OF ELECTROLESS PLATING OF SILVER
[Lee, Jae-Ho;]
Dept. of Metallurgical Engineering and Materials Science, Hong Ik University;
한국표면공학회지, Vol. 32, No. 3, pp. 447-451.
DOI :
CORROSION BEHAVIOR OF Al-Zn ALLOY AS A SACRIFICIAL ANODE OF ORV TUBES
[Jin, Huh;Lee, Ho-Kyun;Lee, Jae-Ho;]
Dept. of Metallurgical Engineering and Materials Science Hongik University;
한국표면공학회지, Vol. 32, No. 3, pp. 452-455.
DOI :
CONDUCTIVE SnO
[Lee, Seung-Chul;Lee, Jae-Ho;Kim, Young-Hwan;]
Dept. of Metallurgical Engineering and Materials Science, Hong Ik University;
한국표면공학회지, Vol. 32, No. 3, pp. 456-460.
DOI :
DIAMOND-LIKE CARBON FILMS FOR ANTIREFLECTION COATINGS OF GERMANIUM INFRATED OPTICAL LENSES
[Kim, Seong-Young;Lee, Sang-Hyun;Lee, Jai-Sung;]
Advanced Consumer Products R&D Center, KITECH;Depart. of Metallurgy and Materials Science, Hanyang University;
한국표면공학회지, Vol. 32, No. 3, pp. 461-466.
DOI :
DEPOSITION OF c-BN FILMS BY PULSED DC BIASING IN MAGNETICALLY ENHANCED ARE METHOD
[Lee, S.H.;Byon, E.S.;Lee, K.H.;J., Tian;Yoon, J.H.;Sung, C.;Lee, S.R.;]
Korea Institute of Machinery & Materials;Harbin Institute of Technology;Changwon National University;Center for Advanced Materials,University of Massachusetts,Lowell,MA 01854,U.S.A;
한국표면공학회지, Vol. 32, No. 3, pp. 467-471.
DOI :
[Jehn, Hermann A.;Kang, Sung-Goon;]
Forschungsinstitut fur Edelmetalle und Metallchemie;Hanyang University, Department of Materials Engineering;
한국표면공학회지, Vol. 32, No. 3, pp. 472-483.
DOI :
Electroless Ni Plating on Pb-base Ceramics
Pb계 Ceramics 기지상의 무전해 Ni 도금
민봉기;유종수;최순돈;신현준;
영남대학교 공과대학 금속 및 재료공학부;영남이공대학 금속·금형설계과;
한국표면공학회지, Vol. 32, No. 4, pp. 487-495.
DOI :
A study on the adhesion of Ag film deposited on Alloy42 substrate
Alloy42 기판 위에 증착된 Ag막의 밀착력에 관한 연구
이철룡;천희곤;조동율;이건환;권식철;
울산대학교 재료공학과;한국기계연구원;
한국표면공학회지, Vol. 32, No. 4, pp. 496-502.
DOI :
The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process
리플로 공정 후에 형성된 In과 Au/Ni/Ti 다층 박막의 계면 구조의 TEM 분석
조원구;김영호;김창경;
한양대학교 공과대학 재료공학부;
한국표면공학회지, Vol. 32, No. 4, pp. 503-512.
DOI :
A study on the effects of variously configured magnets on the characteristics of inductively coupled plasma
자장의 배열 및 형태가 유도결합형 플라즈마에 미치는 효과에 관한 연구
황순원;이영준;유지범;이재찬;염근영;
성균관대학교 재료공학과;
한국표면공학회지, Vol. 32, No. 4, pp. 513-520.
DOI :
Corrosion resistance and Hardness of Tin-Nickel Electrodeposits
주석-니켈합금 도금층의 내식성 및 경도
예길촌;채영욱;
영남대학교 재료·금속공학부;
한국표면공학회지, Vol. 32, No. 4, pp. 521-530.
DOI :
Effect of Brown Oxide Formation on the Fracture Toughness of Leadframe/EMC Interface
Brown Oxide 형성이 리드프레임/EMC 계면의 파괴인성치에 미치는 영향
[H. Y., Lee;J., Yu;]
Dept. of Materials Science and Engineering Korea Advanced Institute of Science and Technology;
한국표면공학회지, Vol. 32, No. 4, pp. 531-537.
DOI :
Photoelectrochemical Property of Ti(IV)-Fe(III) Oxide Films Deposited by MOCVD
MOCVD법에 의한 Ti(IV)-Fe(III) 산화물 박막의 광전기화학적 특성
김현수;윤재홍;
동북공업기술연구소 환경재료연구실;창원대학교 공과대학 금속재료공학과;
한국표면공학회지, Vol. 32, No. 4, pp. 538-546.
DOI :
Interfacial Reaction of Galvanized Steel in Ni Added Zn-0.18Al Bath
Zn-0.18Al 도금욕에서 Ni첨가에 따른 아연 도금강의 계면반응
이경구;기회봉;이도재;
한려대학교 제철금속학과;아시아자동차 기술연구소(주);전남대학교 공과대학 금속공학과;
한국표면공학회지, Vol. 32, No. 4, pp. 547-554.
DOI :
Edge overcoating and buildup of continuously hot-dip metallized strip
연속 용융도금 강판의 에지 과도금 및 빌드업
박정렬;전선호;박노범;
포항제철(주) 기술연구소 광양압연연구그룹;
한국표면공학회지, Vol. 32, No. 4, pp. 555-560.
DOI :
Fracture Toughness of Leadframe/EMC Interface
리드프레임/EMC 계면의 파괴 인성치
이호영;유진;
한국과학기술원 재료공학과;
한국표면공학회지, Vol. 32, No. 6, pp. 647-657.
DOI :
Characterization of a Helicon Plasma Source
헬리콘 플라즈마원의 특성
현준원;노승정;김경례;김창연;김현후;
단국대학교 응용물리학과;두원공과대학 전자공학과;
한국표면공학회지, Vol. 32, No. 6, pp. 658-664.
DOI :
The study on Luminescent properties of Red Emitting phosphor for plasma display panel
PDP용 적색형광체의 발광특성에 관하여
[Choe, J.I.;]
한국표면공학회지, Vol. 32, No. 6, pp. 665-670.
DOI :
Control of ITO/PET Thin Films Depending on the Ratio of Oxygen Partial Pressure in Sputter
스퍼터의 산소분압비율에 의존한 ITO/PET박막의 조절
김현후;신재혁;신성호;박광자;
두원공대 전자과;기술표준원 무기화학과;
한국표면공학회지, Vol. 32, No. 6, pp. 671-676.
DOI :
Design of Amorphous Magnetic Materials for high frequency Sensors Based Upon Permalloy Characteristics
퍼멀로이 특성을 기초로 한 고주파 센서에 사용되는 비정질 자성재료의 개발
[Yoo, C.K.;Kim, C.K.;Chung, Y.C.;O`handley, R.C.;]
Division of Materials Engineering, Hanyang University;Division of Chemical Engineering, Hanyang University;Department of materials science and engineering, MIT;
한국표면공학회지, Vol. 32, No. 6, pp. 677-685.
DOI :
Preparation and Characterization of Insoluble Anodes for Electrodeposition of Ni-W Alloys in Ammoniacal Citrate Bath
Ni-W 합금도금용 불용성 양극의 제조 및 특성 연구
장도연;강성군;
한국기계연구원 표면기술연구부;한양대학교 재료공학부;
한국표면공학회지, Vol. 32, No. 6, pp. 686-694.
DOI :
A study on the factors affecting Cu(Mg) alloy resistivity
Cu(Mg) alloy의 비저항에 영향을 미치는 인자에 대한 연구
조흥렬;조범석;이재갑;박원욱;이은구;
국민대학교 금속재료공학부;한국기계연구원;조선대학교 금속재료공학부;
한국표면공학회지, Vol. 32, No. 6, pp. 695-702.
DOI :
A study of microstructure of Ni-monosilicide fabricated with a thermal evaporator
열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구
안영숙;송오성;양철웅;
서울시립대학교 재료공학과;성균관대학교 금속·재료공학부;
한국표면공학회지, Vol. 32, No. 6, pp. 703-708.
DOI :
Adhesion improvement between metal and ceramic substrate by using ISG process
ISG법에 의한 금속과 세라믹기판과의 밀착력 향상
김동규;이홍로;추현식;
충남대학교 공과대학 금속공학과;조선대학교 공과대학 금속공학과;
한국표면공학회지, Vol. 32, No. 6, pp. 709-716.
DOI :
Abstract
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