Preferred Orientation, Microstructure, Surface Morphology and Mechanical Properties of Electrodeposited Copper Foils
電解銅薄의 優先方位, 斷面組織, 表面形態 및 機械的 性質
김윤근;이동녕;
[Kim, Yoon-Keun;Lee, Dong-Nyung;]
서울대학교 공과대학 금속공학과;
Department of Metallurgical Engineering Seoul National University;
한국표면공학회지, Vol. 18, No. 3, pp. 95-104.
DOI :
A study on the uniformity of the electrodeposits in Pb-Sn-Cu ternary alloy plating
Pb-Sn-Cu삼원 합금 전착층의 균일성 연구
남궁억;권식철;
[NamGoong, E.;Gwon, Sik-Cheol;]
한국기계연구소;
Korea Institute of Machinery & Metals;
한국표면공학회지, Vol. 18, No. 3, pp. 105-115.
DOI :
Effects of Deposition Conditions on the Deposition rate and physical properties of
CVD에 의한
이동윤;이상래;
[Lee, Dong-Yun;Lee, Sang-Rae;]
부산대학교 공과대학 금속공학과;
Department of Metallugical Engineering Pusan National University;
한국표면공학회지, Vol. 18, No. 3, pp. 116-124.
DOI :
Electrodeposition of Nickel from Nickel Sulphamate Baths
설파민산 니켈 도금욕에서의 니켈 전착
[Lee, Hong-Ro;Lee, Dong-Nyung;]
Dept. of Metallurgical Engineering, Chung Nam National Unvirsity;Dept. of Metallurgical Engineering, Seoul National Unvirsity;
한국표면공학회지, Vol. 18, No. 3, pp. 125-133.
DOI :
안인섭;문인형;
[An, In-Seop;Mun, In-Hyeong;]
한양대 공과대학 재료공학과;
한국표면공학회지, Vol. 18, No. 3, pp. 134-137.
DOI :
Abstract
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